Inlay can be divided into two types: dry inlay and wet inlay. Dry inlay is mainly composed of IC wafer and etched aluminum foil antenna, without adhesive backing, and the structure is antenna + chip + chip package; while wet inlay contains adhesive backing and can be directly attached to objects for use. The structure is antenna + chip + chip package + surface paper + bottom paper. The application scenarios of dry inlay require further processing to become labels that can be used directly. Dry inlay is more suitable for application scenarios that require deep customization or processing. For example, self-adhesive labels or white cards, etc. Wet inlay can be used directly, such as labels on the surface of goods, attached to the inside of items, etc.
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